Electronic Packaging and Interconnection Techniques, Education at University Level - A Romanian Experience

The paper presents the ten years experience in the field of university education/training of Romanian students and specialists in the benefit of electronic packaging development and dissemination. The main activities developed in The Center of Technological Electronics and Interconnection Techniques (CETTI), IPC member, a small packaging research center, part of “Politehnica” University of Bucharest, are focused on modules and assemblies. The orientation of CETTI in electronic packaging and interconnection techniques has started many years ago. Regarding CAE-CAD-CAM, this teaching direction was developed in 1992. Companies and professional associations as ARIES (Romanian Association for Electronics Industry and Software), IEEE CPMT, IMAPS, and IEEE Romanian Section have deeply understood the importance of university level practice oriented education, training laboratories and engineering cooperation. CETTI, through its scientific/ technical seminars and workshops, clusters professors, students and specialists from research companies interested in electronic assemblies development and offers solid bridges between academia and enterprises. Every year, in May, CETTI organizes “Interconnection Techniques in Electronics”, The Romanian Inter-University Professional Student Contest in the Field of Printed Circuit Board Design (http://www.cadtieccp.pub.ro/en/student/tieen.html). At the last edition (TIE 2000) more than 70 participants were present at start.